Kinray Laser
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It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, button, textile cutting, gifts and crafts, rubber product.
Low power imported laser, rear focusing, integrated equipment, adjustable optical girder, extensive processing of plane, air cooling, widely applied to graphics and texts marking of gifts and crafts, food packaging, electronic component, PCB bar code, FPCB, ceramic substrate, semiconductor, crystal glass, plastic connector, rubber button, SMD component and other materials.
| Machine model | CO2-H55i | CO2-D30 | CO2-G10 | |
| Laser characteristics | CO2 laser | Supported | ||
| Largest power | 55W | 30W | 10W | |
| Power stability | ±5% | ±5% | ±10% | |
| Marking area | 85mm*85mm | 50mmx50mm | ||
| Engraving speed | ≤3m/s | |||
| Min. line width | 0.12mm | 0.05mm | ||
| Min. character | 0.6mm | 0.2mm | ||
| Repeated position | ±0.01mm | |||
| Protection level | IP54 | |||
| Cooling mode | Air cooling | |||
| Power supply voltage | 220V/10A | 220V/10A | 220V/10A | |
| Power consumption | 2kW | 900W | 300W | |
| Best working environment | Temperature | 15ºC-30ºC | ||
| Humidity | 45%-75% | |||
| Dimension (L*W*H) | Optical system | 1120x620x1370mm | ||
| Control system | Integrated machine | |||
| Cooling system | Air cooling | |||
| Weight | Optical system | 110kg | ||
| Control system | Integrated machine | |||
| Cooling system | Air cooling | |||
Established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging, Laser Internal Modification Machine Si / Sic Wafe, Laser Internal Modification Machine Lt/Ln Wafer, Laser Annealing Machine for Si/Sic, Automatic Dicing Saw Machine (Wafer Packaging)), Automatic Silicone Dispensing Equipment.
